Introducción
1060 Placa chapa aluminio, K'ajóolta'an tumen u excelente conformabilidad, Ka'anal resistencia ti' le corrosión, and good thermal and electrical conductivity, is a commercially pure aluminum alloy with a minimum aluminum content of 99.6%. This article delves into the specifications, Propiedades mecánicas, Aplicaciones, and comparisons with other alloys, making it an essential resource for manufacturers and wholesalers.

1. Especificaciones u 1060 Placa chapa aluminio
1.1 Especificaciones generales
| Especificación |
Descripción |
| Noj |
O, H24, H48, H14, H12 |
| Espesor |
0.2milímetro – 6.0milímetro (8MIL – 240MIL) |
| Kóoch |
100milímetro – 2000milímetro (4 Pulgadas – 78 Pulgadas) |
| Largura |
up to 6000 milímetro (240 ti') |
| Ts'a'akal superficial |
Satin finish, bright finish, Cepillado, Realzado |
| Pattern |
Stucco, diamante, etc. |
| Estándar |
ASTM B209, EN573-1, GB/T3880.1-2012 |
| Equivalent to |
AA 1060, UNS A91060, ISO Al99.6 |
1.2 Propiedades mecánicas
| Propiedad |
Ku (H14 Temper) |
Ku (O Temper) |
| Resistencia le tracción |
83.0 – 115 Mpa |
55.0 – 95.0 Mpa |
| Límite elástico |
>= 70.0 Mpa |
>= 17.0 Mpa |
| Alargamiento le rotura |
1.0 – 10 % |
15 – 25 % |
| Xook elasticidad |
68.9 GPa (10000 Ksi) |
68.9 GPa (10000 Ksi) |
2. Aplicaciones u 1060 Placa chapa aluminio
2.1 Aplicaciones Industriales
| Ka'anatako'ob |
Descripción |
| Automobile Heat Shield |
Utilizes reflective insulation principles. |
| LED Lighting |
High thermal conductivity makes it ideal for LED lamp cups. |
| PS/CTP Plate Base |
Improves efficiency and quality in plate-making and printing production. |
| Heat Sink |
Easy to process and relatively cheap, commonly used in heat dissipation applications. |
2.2 Ba'alba jant p'áatalij
| Ka'anatako'ob |
Descripción |
| Nu'ukul |
Peso ligero, fast heat transfer, and convenient use. |
| Mirror Aluminium |
Used in lighting reflectors, solar heat collection, and various decorative applications. |
| Tread Plate |
Common anti-skid plate with high performance and service life. |
3. Composición química u 1060 Placa chapa aluminio
| Elemento |
Composición (%) |
| Aluminio |
99.60 min |
| Cobre |
0.05 k'aas |
| Hierro |
0.35 k'aas |
| Magnesio |
0.03 k'aas |
| Manganeso |
0.03 k'aas |
| Silicio |
0.25 k'aas |
| Titanio |
0.03 k'aas |
| Vanadio |
0.05 k'aas |
| Zinc |
0.05 k'aas |
| Uláak' |
0.15 k'aas |
4. Comparisons with Other Alloys
4.1 1060 vs 1050 Placa aluminio
| Atributo |
1060 Placa aluminio |
1050 Placa aluminio |
| Aluminum Content |
99.60% min |
99.50% min |
| Silicon Content |
Siibal |
Absent |
| Resistencia le tracción |
Slightly higher |
Lower |
| Application Suitability |
Similar to 1050 |
Similar to 1060 |
4.2 1060 vs 6061 Placa aluminio
| Atributo |
1060 Placa aluminio |
6061 Aleación aluminio |
| Composición |
99.6% Aluminio |
Aluminio, Magnesio, Silicio |
| Muuk' |
Lower |
Higher |
| Dureza |
Lower |
Higher |
| Soldabilidad |
Easier |
More difficult |
| Aplicaciones náats'al |
Electrical components, kitchen utensils |
Aircraft components, Páajtal a automotrices |
5. Disponibilidad stock
5.1 Plate Stock
| Alloy Status |
Yáantajo'ob técnicas (Grosor x Ancho x Largo) |
Common Uses |
| 1060/H18 |
0.18 x 826 x 657 |
Ordinary plate |
| 1060/H14 |
0.26 x 810 x 900 |
Bottle cap material |
| 1060/O |
0.3 x 80 x C |
Power battery case |
5.2 Coil Stock
| Alloy Status |
Yáantajo'ob técnicas (Grosor x Ancho x Largo) |
Common Uses |
| 1060/H18 |
0.75 x 1058 x 1258 |
Ordinary plate |
| 1060/O |
1.9 x 1250 x C |
Coiled material |